| 摘要 |
A rack panel, rack enclosure, and system for cooling electronic components which are vertically mounted in a rack enclosure wherein the system has a front panel with two hollow internal ducts separated by an inner screen-like wall for more evenly distributing and delivering virtually equal amounts of cold air to each component with the rack enclosure. An air inlet, with one or more air movers adjacent thereto, introduces cold air into the front panel, evenly circulates it through the two ducts, and delivers it to the electronic components. A temperature sensor on the exhaust vents of the rear panel of the rack enclosure sensing the temperature of the cold air as it is discharged from the rack enclosure to ensure a continued sustainable degree of cold air is maintained throughout the rack enclosure.
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