| 摘要 |
Disclosed is a multi-step process for the coating of a substrate without re-racking the substrate between the coating operations comprising: providing a substrate holder with an inert protective polymeric coating covering a substantial portion of the holder; affixing a substrate to the substrate holder; electroplating a coating onto the substrate; without re-racking the substrate, applying a physical vapor deposition coating to the coated substrate; and removing the twice coated substrate from the substrate holder.
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