发明名称 DEVICE FOR SLIMMING OF PLATE AND METHOD FOR SLIMMING OF PLATE
摘要 A substrate slimming apparatus and a method thereof are provided to prevent extension of an error by dimples or dents caused by bubbles on a substrate and improve substrate quality by preventing mechanical stresses on the substrate to be etched. A support plate(104) supports a substrate(112) to be etched. A chamber(102) receives the support plate. A supply nozzle(116) supplies chemical for etching to the substrate to be etched. According as the support plate is slantingly disposed, the substrate supported by the support plate is slantlingy disposed. The chemical etches the substrate as flowing down along the slant surface of the substrate. The supply nozzle comprises the followings. A storage chamber stores the chemical. A flowing plate guides the chemical so as to flow by gravity. One or more shoulder parts are protruded on the surface of the flowing plate.
申请公布号 KR100865767(B1) 申请公布日期 2008.10.28
申请号 KR20070025590 申请日期 2007.03.15
申请人 WOO JIN ADVANCED TECH. CO., LTD. 发明人 LEE, SEUNG WOOG;LEE, EUI OK
分类号 G02F1/13;H01L21/306 主分类号 G02F1/13
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