| 摘要 |
<p>A wiring substrate and a manufacturing method thereof are provided to see what position the wiring pattern is formed with respect to a protrusion part by recognizing a surface shape of an upper surface part of an alignment mark exposed from the surface of an insulating layer. A wiring substrate comprises a substrate, a protrusion part, a wiring pattern(40), a pedestal for mark, an alignment mark(20), a pedestal for mark, and an insulating layer. The protrusion part is made of an insulator and formed on a surface of the substrate. The wiring pattern is formed on the surface of the substrate, and extends on a top part(32b) of the protrusion part. The pedestal for mark is formed on the surface of the substrate, whose top part is formed in a rectangular or circular plane shape. The alignment mark is formed on the top part of the pedestal for mark, and formed in a shape in which a length of a horizontal direction and a length of a vertical direction are respectively longer than a length of a horizontal direction, and a length of a vertical direction of the top part of the pedestal for mark and a shape in which an area present in the top part of the pedestal for mark is smaller than an area of the top part of the pedestal for mark. The insulating layer covers the surface of the substrate, wherein a surface of a connection part of the wiring pattern formed on the top part of the protrusion part is exposed from a surface of the insulating layer, and a surface of an upper surface part of the alignment mark is exposed from the surface of the insulating layer.</p> |
