HIGH POWER LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

摘要

A high-output LED package and a manufacturing method thereof are provided to improve light extraction efficiency by forming a concavo-convex pattern on a surface of a resin package part. A mold frame having a concavo-convex pattern(P) is prepared. A transparent resin solid material having the concavo-convex pattern formed on a surface thereof is prepared by using the mold frame. A concavo-convex film(270) is prepared by cutting the concavo-convex pattern of the transparent resin solid material. An LED package structure(221) having a groove and an LED chip(225) formed in the groove is prepared. The groove including the LED chip is filled with a liquefied transparent resin. The concavo-convex film is loaded on the liquefied transparent resin. The concavo-convex film is raised above the groove part. A hardening process is performed to harden the liquefied transparent resin.