| 摘要 |
An automatic soldering device for PCB(Printed Circuit Board) patterns is provided to improve productivity without an additional process for manually soldering an upper pattern of a PCB. An automatic soldering device(10) for PCB patterns includes a leg unit(13), a head unit(11), and a soldering unit(12). The leg unit is inserted into an insertion hole(50) passing through upper and lower patterns(20,40) and a substrate(30). The head unit is formed above the leg unit and has a larger diameter than that of the leg unit. The soldering unit is bonded under the head unit. The soldering unit is automatically soldered on the upper pattern by heat generated from a solder pot line when an end of the leg unit, which passes through the lower pattern to be protruded, is soldered by the solder pot line.
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