发明名称 STRUCTURE D'INTERCONNEXIONS ET PROCEDE DE REALISATION
摘要 The process involves forming a layer with conducting zones (24), made of copper, and insulating zones (26), made of organic material, on a substrate. The layer is covered by a porous layer (28), where the porous layer is a derivative of ethylene phthalate. A part of the organic material is consumed and eliminated via the porous layer by using enzymes and proteins, where the organic material has a polysaccharide or proteinic nature. The substrate is heated or UV radiation is directed towards the substrate for ending a reaction of the consumption of the material. An independent claim is also included for a connection structure comprising a layer with conducting zones.
申请公布号 FR2897198(B1) 申请公布日期 2008.09.19
申请号 FR20060050443 申请日期 2006.02.08
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ETABLISSEMENT PUBLIC A CARACTERE INDUSTRIEL ET COMMERCIAL 发明人 LOUIS DIDIER
分类号 H01L23/522 主分类号 H01L23/522
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