发明名称 APPARATUS AND METHOD FOR SOLDERING FLAT WORK PIECE
摘要 A soldering apparatus including a vessel (109) containing a molten solder, a casing (106) defining therewithin a soldering chamber (106c) in which a flat overflowing wave of the molten solder is formed, a conveyor (107) physically integrated with the casing (106) for movement therewith and operable for transferring a printed circuit board (3) through the soldering chamber (106c), actuators (118) and (119) for vertically moving the casing (106), inert gas feeders (114a) for feeding an inert gas to the soldering chamber (106c), and a controller for controlling the operation of the actuators (118) and (119), so that the printed circuit board (3) is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber (106c).
申请公布号 KR20080084807(A) 申请公布日期 2008.09.19
申请号 KR20087014192 申请日期 2006.12.08
申请人 FUJITSU TEN LIMITED;NIHON DEN-NETSU KEIKI CO., LTD. 发明人 AOYAMA NOBUYUKI;IKEDO KENSHI;OKUNO AKIRA;ARITA MASATO
分类号 B23K1/08;B23K31/02 主分类号 B23K1/08
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