| 摘要 |
A printed board and a gas exhausting method thereof are provided to exhaust air or gas expanded due to heat of soldering from a gap between the printed board and a mounted component without a special component or hole. A printed board(1) includes a dummy pattern(5). The dummy pattern is formed in a wiring region including a mounting region of a component(2) such as an electrolytic condenser and electrically isolated to be partially overlapped with the mounting region of the component. A gap is formed between a surface of the printed board and a lower surface of the component by a height difference between the dummy pattern and the surface of the printed board to exhaust air or gas expanded due to heat of soldering. The dummy pattern forms a difference of altitude corresponding to a thickness difference between a copper film and the dummy pattern.
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