发明名称 CIRCUIT BOARD HAVING GOOD HEAT RADIATION PROPERTY AND LIGHT EMITTING MODULE USING THE CIRCUIT BOARD
摘要 A PCB(Printed Circuit Board) having good heat radiation property and an LED(Light Emitting Diode) module using the same are provided to realize the good heat radiation property at a low manufacturing cost, and realize the LED module having the good heat radiation property by mounting an LED or an LED package on the PCB having the good heat radiation property. A PCB(20) includes a heat radiating steel plate(22) and a metallic wiring layer(30) attached to one side of the heat radiating steel plate. The heat radiating steel plate includes a metallic layer(200), upper contacting/heat radiating layers(210,220) sequentially formed to an upper side of the metallic layer, and lower upper contacting/heat radiating layers(212,222) sequentially formed to a lower side of the metallic layer. The metallic layer includes a core metallic layer(202) and upper/lower metallic layers(204,206) formed to the upper/lower side of the core metallic layer. The core metallic layer is made of iron and the upper/lower metallic layers are made of zinc.
申请公布号 KR20080084431(A) 申请公布日期 2008.09.19
申请号 KR20070026146 申请日期 2007.03.16
申请人 SAM LASER DISPLAY CO. 发明人 HWANG, YOUNG MO
分类号 G06F1/20;G06F1/00 主分类号 G06F1/20
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