STACK SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE HAVING THE DEVICE AND METHOD OF FABRICATING THE DEVICE

摘要

A stacked semiconductor device is provided to effectively increase integration of a semiconductor device and a semiconductor package by forming a semiconductor device in one process wherein a plurality of unit device layers are stacked in the semiconductor device. A lower device(D1) is positioned on the lower surface of an intermediate insulation layer(300). A lower pad(210) is electrically connected to the lower device. An upper device(D2) is positioned on the upper surface of the interlayer dielectric. An upper pad(410) is electrically connected to the upper device. The lower pad can be electrically connected to the upper pad. The lower and upper devices can have a mutually reversed layer structure.