A lamp type LED is provided to prevent fine cracks and to secure reliability thereof by attaching a gold wire to a gold bumping ball having high flexibility. A first lead frame includes a groove having a shape of a depressed cup. The first lead frame has conductivity. An LED semiconductor chip(16) includes one electrode connected to the groove of the first lead frame. A bumping ball(40) is formed at the other electrode of the LED semiconductor chip. A second lead frame(14) includes a bumping ball formed at one end thereof. The other end of the second lead frame is connected to the LED semiconductor chip to supply electric power. A gold wire(18) is formed to connect the LED semiconductor chip with the bumping ball of the second lead frame. A silicon mold is formed to surround the LED semiconductor chip. An epoxy mold is formed to surround and package the lead frame and the LED semiconductor chip.
