| 摘要 |
<p>A package of a light emitting diode and a method for manufacturing the same are provided to improve the optical efficiency and thermal characteristic of the light emitting diode by processing a silicon substrate. Grooves are formed on a first surface of a silicon substrate(410). Unevenness(430) is formed on a second surface of the silicon substrate. One of red, green, and blue light emitting diodes is mounted on the respective grooves. The green and blue light emitting diodes are mounted on a pair of electrodes being formed on the groove and a pair of bumps being formed on the pair of electrodes. The red light emitting diode is mounted on a single electrode being formed on the groove through a conductive epoxy or conductive paste. At least one wire connected to the red light emitting diode is bonded to the silicon substrate. A lens covers the whole of the mounted light emitting diodes. Alternatively, plural lenses cover the respective light emitting diodes.</p> |
