| 摘要 |
A semiconductor chip, a method for manufacturing the same, and a semiconductor package using the semiconductor chip are provided to decrease the thickness of the semiconductor chip and to promptly dissipate heat generated in the semiconductor chip by attaching a reinforcing member to a lower surface of a semiconductor body. Circuit units are formed in a semiconductor body(110). A bonding unit(120) is electrically connected to the circuit units and arranged on a first surface of the semiconductor body. An external electric signal is inputted into the bonding unit. A reinforcing member(130) is attached to a second surface of the semiconductor body opposite to the first surface, thereby reinforcing the stiffness of the semiconductor body. The second surface is grinded. The reinforcing member includes an adhesive agent being attached to a soft reinforcing plate and one surface of the reinforcing plate and attaching the reinforcing plate to the second surface of the semiconductor body. The reinforcing plate is made of one selected from glass, ceramic, plastic, and metals. |
