发明名称 LASER MACHINING APPARATUS
摘要 <p>A laser processing apparatus is provided to enable projection of a mask pattern onto an object to be processed with an excellent pattern dimension precision, and to obtain an excellent processing precision. A laser processing apparatus for projecting the pattern of a mask(330) onto an object(320) to be processed by placing the mask supporting a fixed projection lens(310) and the object in a conjugate relation and moving the mask and the object at the same time, comprises a unit for observing alignment marks formed on the surface of the object. An elongation amount(Ex) for the set point in the main scanning direction of the object, and an elongation amount(Ey) for the set point in the subsidiary scanning direction is calculated. The elongation amount(Ex) is amended with the imaging magnification(M) of the projection lens. The elongation amount(Ey) is amended with the moving rate of the mask and/or the object considering the magnification(M).</p>
申请公布号 KR20080084583(A) 申请公布日期 2008.09.19
申请号 KR20080014401 申请日期 2008.02.18
申请人 HITACHI VIA MECHANICS, LTD. 发明人 MARUYAMA SHIGENOBU;AOYAMA HIROSHI;SHIGA MASAYUKI;OHMAE GOICHI
分类号 G03F7/20;H01L21/027 主分类号 G03F7/20
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