发明名称 MANUFACTURING METHOD OF LIGHT EMITTING DIODE SUBSTRATE
摘要 <p>A method of manufacturing a light emitting diode substrate is provided to form a reflection portion having a required slant and size by coating a light emitting diode substrate with conductive paste, and drilling the hardened conductive paste. A method of manufacturing a light emitting diode substrate includes the steps of: coating the surface of a substrate having a circuit with a conductive paste(7); heating the conductive paste to harden; boring the hardened conductive paste with a drill(20) having a conical tip at the point for installation of a light emitting diode to make a space having a tapered lateral wall to a reflection portion(9). The surface of the reflection portion is coated with Ag plating or Ni plating.</p>
申请公布号 KR20080084619(A) 申请公布日期 2008.09.19
申请号 KR20080020882 申请日期 2008.03.06
申请人 TATSUTA SYSTEM ELECTRONICS CO., LTD. 发明人 IWAI KIYOSHI;MURAKAMI HISATOSHI
分类号 H01L33/60;H01L33/62 主分类号 H01L33/60
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