发明名称 |
MANUFACTURING METHOD OF LIGHT EMITTING DIODE SUBSTRATE |
摘要 |
<p>A method of manufacturing a light emitting diode substrate is provided to form a reflection portion having a required slant and size by coating a light emitting diode substrate with conductive paste, and drilling the hardened conductive paste. A method of manufacturing a light emitting diode substrate includes the steps of: coating the surface of a substrate having a circuit with a conductive paste(7); heating the conductive paste to harden; boring the hardened conductive paste with a drill(20) having a conical tip at the point for installation of a light emitting diode to make a space having a tapered lateral wall to a reflection portion(9). The surface of the reflection portion is coated with Ag plating or Ni plating.</p> |
申请公布号 |
KR20080084619(A) |
申请公布日期 |
2008.09.19 |
申请号 |
KR20080020882 |
申请日期 |
2008.03.06 |
申请人 |
TATSUTA SYSTEM ELECTRONICS CO., LTD. |
发明人 |
IWAI KIYOSHI;MURAKAMI HISATOSHI |
分类号 |
H01L33/60;H01L33/62 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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