发明名称 PLATE KEYPAD, AND METHOD FOR MANUFACTURING THE SAME
摘要 A plate keypad and a method for manufacturing the same are provided to improve adhesion between a low-temperature thermal bonding layer by forming scratches or performing predetermined treatment on the low-temperature thermal bonding layer and a urethane sheet layer. A plate keypad includes a first layer and a second layer(200). The first layer has a plate layer with a predetermined pattern, a screen ink layer formed on a lower surface of the plate layer, and a low-temperature thermal bonding layer coated on a lower surface of the screen ink layer. The second layer has a urethane sheet layer(40) and a silicon pad layer(50). The urethane sheet layer is bonded to a lower surface of the low-temperature thermal bonding layer by being heated under a first condition. The silicon pad layer is bonded to a lower surface of the urethane sheet layer by being heated under a second condition with a heating temperature higher than that of the first condition.
申请公布号 KR20080084080(A) 申请公布日期 2008.09.19
申请号 KR20070025206 申请日期 2007.03.14
申请人 TAEYANG ELECTRONICS CO., LTD. 发明人 JEONG, SUNG HO;KANG, MYUNG KWANG;YOO, HAI KEUN
分类号 H01H13/704;H01H11/00;H01H13/70 主分类号 H01H13/704
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