发明名称 |
PLATE KEYPAD, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A plate keypad and a method for manufacturing the same are provided to improve adhesion between a low-temperature thermal bonding layer by forming scratches or performing predetermined treatment on the low-temperature thermal bonding layer and a urethane sheet layer. A plate keypad includes a first layer and a second layer(200). The first layer has a plate layer with a predetermined pattern, a screen ink layer formed on a lower surface of the plate layer, and a low-temperature thermal bonding layer coated on a lower surface of the screen ink layer. The second layer has a urethane sheet layer(40) and a silicon pad layer(50). The urethane sheet layer is bonded to a lower surface of the low-temperature thermal bonding layer by being heated under a first condition. The silicon pad layer is bonded to a lower surface of the urethane sheet layer by being heated under a second condition with a heating temperature higher than that of the first condition.
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申请公布号 |
KR20080084080(A) |
申请公布日期 |
2008.09.19 |
申请号 |
KR20070025206 |
申请日期 |
2007.03.14 |
申请人 |
TAEYANG ELECTRONICS CO., LTD. |
发明人 |
JEONG, SUNG HO;KANG, MYUNG KWANG;YOO, HAI KEUN |
分类号 |
H01H13/704;H01H11/00;H01H13/70 |
主分类号 |
H01H13/704 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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