| 摘要 |
<p>The case has a microwave frequency silicon chip (44) arranged on a substrate (50) via an active surface. The chip includes electronic components, optical elements, optical receivers and electrical conductors. The substrate includes, on a side of a metallized face (80), optical ports opposite to optical ports of the chip. The substrate includes optical connections connecting the former optical ports to an optical port of another metallized face (90) of the substrate. Independent claims are also included for the following: (1) a method for fabricating a microwave frequency case (2) a method for fabricating an interconnection circuit.</p> |
