发明名称 POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE(DAP) AND METHOD OF FABRICATING THE SAME PACKAGE
摘要 A power device package comprising a metal tab DAP and a method for fabricating the same package are provided to prevent the penetration of foreign materials to die by increasing the interface creepage distance of the sealant. A power device package includes a lead frame(100), a metal tab DAP(Die Attach Paddle)(200), and a die for power device(300). The metal tab DAP is stacked on the lead frame. The dies for power device is stacked on the metal tab DAP. The metal tab DAP is stacked on the lead frame by first conductive adhesive materials. The die is stacked on the metal tab DAP by second conductive adhesive materials. A melting point of the first conductive adhesive materials is higher than that of the second conductive adhesive materials.
申请公布号 KR20080065153(A) 申请公布日期 2008.07.11
申请号 KR20070002184 申请日期 2007.01.08
申请人 FAIRCHILD KOREA SEMICONDUCTOR LTD. 发明人 SON, JOON SEO;JEON, O SEOB;LEE, TAEK KEUN;LEE, BYOUNG OK
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
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