| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for monitoring the integrity of a ground member coupling a substrate support to a chamber body in a plasma processing system. <P>SOLUTION: In one embodiment, a processing chamber is provided that includes a ground path member coupled between a substrate support and a chamber body. A sensor is positioned to sense a metric indicative of current passing through the ground member. In another embodiment, a method monitoring the integrity of a ground member coupling a substrate support to a chamber body in a plasma processing chamber includes monitoring a metric indicative of current passing through the ground member during processing, and setting a flag in response to the metric exceeding a predefined threshold. <P>COPYRIGHT: (C)2008,JPO&INPIT |
