| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side surface light emitting diode package which can be mounted on a printed circuit board with ease of positioning. <P>SOLUTION: The side surface light emitting diode package 1 is mounted on a printed circuit board with at least one solder bump. The side surface light emitting diode package includes a silicon substrate 10, a holding space 11, a bonding surface 12, and a positioning structure 13. The silicon substrate has a first surface 101 and a second surface 102. The holding space has a top opening on the first surface and a bottom for holding a light emitting diode 100 thereon. The bonding surface is formed on a side surface of the silicon substrate, and is bonded on a printed circuit board. The positioning structure has at least one solder receptacle 131 near the bonding surface and corresponding to the solder bump. The solder bump is melted during soldering treatment and is received in the solder receptacle. <P>COPYRIGHT: (C)2008,JPO&INPIT |
