DEVICE FOR FORMING SEMICONDUCTOR LAYER AND METHOD FOR FORMING SEMICONDUCTOR LAYER

摘要

PROBLEM TO BE SOLVED: To provide a device for forming semiconductor layer and a method for forming a semiconductor layer capable of shortening a processing time of a substrate forming by transferring an ink including a semiconductor material buried in a groove for expressing a pattern of the semiconductor layer and forming the semiconductor layer on the surface of the substrate. SOLUTION: The groove 7 for expressing the pattern of a thin film transistor (TFT) is formed on the surface of a roller 1. A tank 2 supplies the ink 5 including at least the semiconductor material to the roller 1. A squeegee 3 fills the ink 5 supplied to the roller 1 in the groove 7 formed on its surface. The roller 1 transfers the ink 5 filled in the groove 7 to the substrate 4. COPYRIGHT: (C)2008,JPO&INPIT