| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin three-dimensional inter-board connection structure which can properly connect a plurality of circuit boards by absorbing mechanical deformation, such as warpages and is effective for shielding, and to provide its production process and a three-dimensional circuit device that uses it. SOLUTION: The three-dimensional inter-board connection structure 2 comprises a frame-like housing 8, having an inner circumferential portion 6 and an outer circumferential portion 4, a plurality of connection terminal electrodes connecting the upper and lower surfaces of the housing 8, and bumps 22 provided on a plurality of connection terminals 18 and 20, on at least one side of the housing. COPYRIGHT: (C)2008,JPO&INPIT
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