| 摘要 |
PROBLEM TO BE SOLVED: To prevent influence by the outflow of solder and the projection of an adhesive, etc. , and to eliminate the need for a positioning jig upon manufacture in a manufacturing method of a semiconductor device. SOLUTION: An insulating substrate 1 where a semiconductor chip is mounted, is attached to a base plate 3, and a printed board 2 electrically connected with the semiconductor chip is attached to the base plate 3. A recessed groove part 4 is formed on the outer side of the outer peripheral part of the insulating substrate 1 of the base plate 3, a recessed groove part 5 is formed on the outer side of the outer peripheral part of the printed board 2 of the base plate 3, and a recessed groove part 6 is formed on the outer side of the outer peripheral part of the semiconductor chip of the insulating substrate 1. Then, the recessed groove parts 4-6 are used for positioning an assembly jig. COPYRIGHT: (C)2008,JPO&INPIT
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