| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact for electric test of a semiconductor device which is not give a contact mark and damage in a solder ball, corresponding to variation in the dimensions which occurs by the solder ball, such as, in BGA and CSP package of the semiconductor, and also having a proper electrical contact. SOLUTION: The contact consists of a bar shape contact which is banded together in a plurality of bar shape metal wires which have elasticity, or the bar-shape contact or the bar-shape contact and coil spring are fixed in banding part of the bar-shape contact, thereby, the contact is integrated electrically. COPYRIGHT: (C)2008,JPO&INPIT
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