摘要 |
A backside contact pad is formed in an integrated circuit, possibly designed initially with just top side contact pads ( 150 C), by forming an opening ( 220 ) through a top side contact pad ( 150 C) and the semiconductor substrate ( 110 ). Conductive material ( 520, 540, 1110, 1130 ) is formed in the opening and in contact with the top side pad. The conductive material also provides a backside contact pad ( 1310 ). Other embodiments are also provided.
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