发明名称 Phase change memory device and method for fabricating the same
摘要 A phase change memory device is provided. The phase change memory device includes a substrate with a first electrode layer formed thereon. A first phase change memory structure is on the first electrode layer and electrically connected to the first electrode layer. A second phase change memory structure is on the first phase change memory structure and electrically connected to the first phase change memory structure, wherein the first or second phase change memory structure includes a cup-shaped heating electrode. A first insulating layer covers a portion of the cup-shaped heating electrode along a first direction. A first electrode structure covers a portion of the first insulating layer and the cup-shaped heating electrode along a second direction. The first electrode structure includes a pair of phase change material sidewalls on a pair of sidewalls of the first electrode structure and covering a portion of the cup-shaped heating electrode.
申请公布号 US2008164454(A1) 申请公布日期 2008.07.10
申请号 US20070797730 申请日期 2007.05.07
申请人 WINBOND ELECTRONICS CORP. 发明人 CHEN WEI-SU
分类号 H01L45/00 主分类号 H01L45/00
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