| 摘要 |
<p>Disclosed is a cooling system for a memory module, which includes a plurality of RAMs high-density mounted on a PCB thereof. In the system for radiating heat of a memory module, heat generated in unsymmetrical distribution by a Module Advanced Memory Buffer (AMB) in a Fully Buffered Dual In-line Memory (FBDIMM) can be uniformly distributed to memory devices thereof. In the cooling system for a memory module, the FBDIMM having an unsymmetrical distribution in generating heat effectively radiates heat so that the operating temperature of the AMB can decrease in comparison with the conventional art. Furthermore, temperature variation between the AMB and the RAMs is much improved, thereby securing reliability in the operating temperatureof the memory module.</p> |
