REDUCTION-TYPE ELECTROLESS TIN PLATING SOLUTION AND TIN PLATING FILMS MADE BY USING THE SAME

摘要

The invention aims at providing a reduction-type electroless tin plating solution which is suppressed in the substitution reaction on a substrate copper or copper alloy and enables stable deposition and which is stable and good for practical use, and provides a reduction-type electroless tin plating solution characterized by comprising as the essential constituents a water-soluble tin compound, a water-soluble titanium compound, and an organic complexing agent containing trivalent phosphorus; a process for the production of tin plating films by using the tin plating solution; and tin plating films obtained by electroless plating with the solution.