| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for carrying out an etching treatment and peeling processing for a substrate, in which the foot print of the apparatus as a whole is reduced, equipment cost is reduced, and the apparatus construction is simplified. SOLUTION: The apparatus includes an etching process section 10 for etching a metal thin film formed covering the substrate surface, by supplying an etching liquid from a spray nozzle 24 to the substrate inside an etching process vessel 14, and a peeling process section 12 for peeling a resist film to remove thereof from the surface of the metal thin film on the substrate by supplying a peeling liquid from a spray nozzle 44 to the post-etching-process substrate inside a peeling process vessel 34, wherein a solution mainly composed of an amine-based organic solvent is supplied to the spray nozzle 44 inside the peeling process vessel 34, and a diluted solution in which water has been added to the solution mainly composed of the amine-based organic solvent is supplied to the spray nozzle 24, inside the etching process vessel 14. COPYRIGHT: (C)2008,JPO&INPIT
|
