| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device which accurately controls the temperature of a focus ring without causing abnormal discharge or backward flow of high-frequency power while high-frequency power is applied. SOLUTION: A substrate processing device 10 includes: a circular focus ring 24 arranged to surround the peripheral border portion of a wafer W; and a focus ring temperature controller 26 which has a circular induction coil 36 that is located in opposition to the focus ring 24 to generate magnetic force lines upon receiving the power from a power supply rod 38. Resultant magnetic force lines intersect with an induction heating section 40, resulting in eddy current being generated in the induction heating section 40 because of magnetic field induction. Joule heat arising from the eddy current and electrical resistance of the induction heating section 40 heats the induction heating section 40, which leads to self-heating of the focus ring 24. COPYRIGHT: (C)2008,JPO&INPIT
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