发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, improved in cleaning cycle of metal molds. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent, an inorganic filler and a reaction product of 12-hydroxystearic acid with amino group-containing polysiloxane, wherein the reaction product is a compound represented by formula (1) (wherein, m is an integer of 5-500). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008156471(A) 申请公布日期 2008.07.10
申请号 JP20060346744 申请日期 2006.12.22
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 IKEDA HIRONORI
分类号 C08L63/00;C08K5/5455;H01L23/29;H01L23/31 主分类号 C08L63/00
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