摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, improved in cleaning cycle of metal molds. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent, an inorganic filler and a reaction product of 12-hydroxystearic acid with amino group-containing polysiloxane, wherein the reaction product is a compound represented by formula (1) (wherein, m is an integer of 5-500). COPYRIGHT: (C)2008,JPO&INPIT
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