| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste composition having excellent dispersibility, hardly causing dispersion of the measured result, obtaining high conductivity and adhesive property without forcing out conductive paste outside of a target applied portion in thermocompression bonding and having excellent heat resistance, and to provide an electronic component using the conductive paste composition and its manufacturing method. SOLUTION: The conductive paste composition contains (A) thermoplastic resin with at least one of specific repetition units, (B) thermosetting resin, (C) a setting agent, (D) a conductive filler and (E) an organic solvent. The content of thermosetting resin is 10-95 wt.% of the total amount of (A) thermoplastic resin and (B) thermosetting resin, and the content of the conductive filler is 60-95 wt.% of the total amount of (A) thermoplastic resin, (B) thermosetting resin, (C) the setting agent and (D) the conductive filler. COPYRIGHT: (C)2008,JPO&INPIT
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