发明名称 MEMS Sensor Suite on a Chip
摘要 The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.
申请公布号 US2008163687(A1) 申请公布日期 2008.07.10
申请号 US20080051905 申请日期 2008.03.20
申请人 MORGAN RESEARCH CORPORATION 发明人 KRANZ MICHAEL SCOTT;ELLIOTT ROBERT FAYE;WHITLEY MICHAEL RAY;WILLIAMS MARTY RAY;REINER PHILIP JOHN
分类号 G01P15/125;G01K13/00;G01N7/00 主分类号 G01P15/125
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