| 摘要 |
A system and method for forming a conductive pattern. In the illustrative embodiment, the system includes an applicator for applying a conductive substance onto a surface of a structure and a mechanism for precisely moving the applicator such that the conductive substance is applied in a desired pattern. In an illustrative embodiment, the mechanism includes a robotic arm driven by commands from a computer, and the conductive pattern is designed to manipulate the electromagnetic properties of the structure. The system can be used to apply a conductive pattern directly onto an electromagnetic component, such as a radome, IR dome, multi-mode dome, or flat plate EM window, or to apply a conductive pattern onto a component mold during the component fabrication process. In the latter case, the conductive pattern is an integrated part of the component.
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