| 摘要 |
A multi-chip package including a carrier, at least one first chip, and a second chip is provided. The first chip is electrically connected to the carrier and disposed on the carrier. The second chip is electrically connected to the first chip and the carrier. A part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier. A method of fabricating the multi-chip package is also provided.
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