POLYIMIDE FILM WITH IMPROVED ADHESIVENESS

摘要

A polyimide film derived from a polyamic acid resin obtained by copolymerization of an aromatic acid dianhydride component and an aromatic diamine component comprising 5 to 60 mole% of a diamine having a sulfonyl group in its main chain based on the total mole of the aromatic diamine component has a Young¡¯s modulus of 4.5 to 9.5 GPa, a tensile strength at breakage of 15 to 30 kgf/§±, a tensile elongation at breakage of 25 to 60%, and a ratio of the tensile strength at breakage to the yield strength of less than 1.35. Therefore, the polyimide film exhibits improved adhesive strength with metal, flexural endurance and punching characteristics, and thus, can be efficiently used in electronic devices.