| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide thermosetting resin composition useful for a wiring protective film for TCP, which is excellent in insulation reliability for a long time, while realizing low temperature curability and low warpage. SOLUTION: The thermosetting resin composition comprises 100 pts.wt. of a soluble polyimide having a concentration of a phenolic hydroxy group of 0.55-1.0 mol/kg, 20-200 pts.wt. of an epoxy-modified polybutadiene, and an organic solvent. COPYRIGHT: (C)2008,JPO&INPIT
|
