| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition being low in dielectric loss tangent and having excellent heat resistance and adhesiveness, and to provide a prepreg and a laminated board each using the same. SOLUTION: The resin composition comprises an epoxy resin and an alkylphenol-modified xylene resin, wherein the content of the alkylphenol-modified xylene resin is 20-70 wt.% of the whole resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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