| 摘要 |
Systems and methods for applying a conformal coating material to a substrate, such as an electronic component or circuit board. The systems and methods rely on a pressure-regulated fluid circulation loop connecting an outlet of a pump with an inlet of a pump and an applicator that is connected in fluid communication with the fluid circulation loop. Amounts of the conformal coating material dispensed by the applicator, which are diverted from the fluid circulation loop, may be replenished by fresh amounts supplied from a non-pressurized reservoir, which are siphoned by the pump into the fluid circulation loop.
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