发明名称 APPARATUS AND METHOD FOR FORMING FILM
摘要 PROBLEM TO BE SOLVED: To provide a film-forming apparatus which forms a film stably by decomposing film-forming gas having high decomposition temperature, and also to provide a film-forming method which forms a film stably by decomposing the film-forming gas having high decomposition temperature. SOLUTION: The film-forming apparatus has: a treatment vessel, where film-forming gas is supplied to the inside of a pressure-reduced space; a substrate holding section that is installed in the pressure-reduced space and holds the substrate to be treated; and a heater that is installed in the pressure-reduced space and heats the substrate to be treated to form a film by the film-forming gas on the substrate to be treated. The heater is made of a compound containing having high melting point metal and carbon. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008159945(A) 申请公布日期 2008.07.10
申请号 JP20060348458 申请日期 2006.12.25
申请人 TOKYO ELECTRON LTD 发明人 MORIZAKI EISUKE;KOBAYASHI HIROKATSU;HARASHIMA MASAYUKI
分类号 H01L21/205 主分类号 H01L21/205
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