| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which is scarcely broken even when it is subjected to a local stress, and wherein even when it is broken, damage is scarcely done to the inside of the vacuum vessel. SOLUTION: This plasma processing apparatus comprises the vacuum vessel 100 having a dielectric window 107, a means 103 for supporting a substrate 102 to be processed installed in the vacuum vessel, a first exhausting means 106 for exhausting the inside of the vacuum vessel, and a means for introducing a processing gas into the vacuum vessel. Further, it comprises a microwave introducing means 105 for introducing a microwave into the vacuum vessel through the dielectric window, closed space forming means 121, 122 and 123 for forming closed space on the microwave introducing means side of the dielectric window, and second exhausting means 124 and 125 for exhausting the inside of the closed space. COPYRIGHT: (C)2008,JPO&INPIT
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