SEALING MATERIAL FOR ELECTRONIC COMPONENT, AND FORMATION METHOD AND APPARATUS THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a sealing material for electronic components that are improved in shock resistance, moisture resistance, or the like, and also to provide a formation method and a forming apparatus of the sealing material for electronic components improved in productivity. SOLUTION: In the formation method of a sealing material for electronic components, the sealing material for electronic components is made of a cured product formed by curing at least two kinds of photopolymerization compositions. The formation method comprises: a first resin installation process for installing the first photopolymerization composition; a second resin installation process for installing a second photopolymerization composition; and a resin-curing process for curing at least one of the first and second resins. COPYRIGHT: (C)2008,JPO&INPIT