发明名称 MASK AND FORMING METHOD OF RESIN LAYER
摘要 PROBLEM TO BE SOLVED: To form a resin layer 42 so as not to develop an ununiform thickness therein. SOLUTION: A mask 1 includes a plate 10 which has a plurality of through holes 20 for charging resin 40 therethrough. The opening shape of each of a plurality of the through holes 20 is respectively a circle or a regular polygon. A plurality of the through holes 20 includes through holes 22, which belong to a first group, and through holes 22, which belong to a second group and surround the periphery of the through holes 24 belonging to the first group. The opening area of each of the through holes 22 belonging to the first group is respectively larger than that of each of the through holes 24 belonging to the second group. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008155411(A) 申请公布日期 2008.07.10
申请号 JP20060344708 申请日期 2006.12.21
申请人 SEIKO EPSON CORP 发明人 KUROSAWA YASUNORI
分类号 B41N1/24;H01L21/60 主分类号 B41N1/24
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