High-density packaging multi-chip semiconductor module - includes signal transmission substrate with wiring layer for transmitting signals and feeder substrate with containers for accommodating semiconductor bare chips which are bonded to wiring layer

摘要

The module has a feeder substrate (2) supplying power to the semiconductor elements (3) as a 'bare chip'.It also includes containers (2a) for accommodating the semiconductor elements which are bonded to the wiring layer (1b) of the signal transmission substrate (1) for transmitting signals to the semiconductor elements. The signal transmission substrate which covers the containers is also bonded to the feeder substrate. The wiring layer is a multi-layer formed by repeated formation of the insulator and conductive pattern on the base (1a) by thin film technology. The element electrode (1d), feeder electrodes (1e) and inter-substrate input/output electrodes (1f) are located on the front of the wiring layer.