HEAT REJECTION SYSTEM FOR THERMOELECTRIC COOLING MODULES

摘要

An enclosure cooling system for cooling an interior space with a removeable shelf is provided having a plurality of thermoelectric cooling modules affixed and thermally coupled thereto. A plenum is provided supporting a plurality of exhaust tubes facing a thermoelectric cooling module. An air cooler is positioned adjacent an air input opening in the plenum for forcing cooled air into the plenum interior.