CMP SLURRY COMPOSITION FOR FORMING METAL WIRING LINE
摘要
<p>Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line.</p>
申请公布号
WO2008082177(A1)
申请公布日期
2008.07.10
申请号
WO2007KR06931
申请日期
2007.12.28
申请人
LG CHEM, LTD.;SHIN, DONG-MOK;CHOI, EUN-MI;CHO, SEUNG-BEOM;HA, HYUN-CHUL
