| 发明名称 |
BONDING PAD FABRICATION METHOD, BONDING PAD, METHOD FOR FABRICATING AN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE |
| 摘要 |
A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47. |
| 申请公布号 |
KR100845505(B1) |
申请公布日期 |
2008.07.10 |
| 申请号 |
KR20060069582 |
申请日期 |
2006.07.25 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/60;H01L23/48;H05K3/12 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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