| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a wiring substrate with a built-in electric component, which provides excellent mountability and mounting reliability even when a semiconductor device, etc., is flip-chip mounted on substrate surface, the wiring substrate being also excellent in connection reliability. <P>SOLUTION: The wiring substrate with a built-in electric component includes an insulating substrate 1 which has insulating layers 1a, 1b formed of an organic material, a wiring conductors 8, 9 formed on the surface of the insulating layer, and a via-hole conductors 10, 11, 17 electrically connected to the wiring conductors and traversing the thickness of the insulating layer; and a ceramic capacitor 3 having an external electrode which is electrically connected to an internal electrode and which is disposed on the top surface of a laminate produced by laminating a plurality of dielectric layers and internal electrodes. The ceramic capacitor is arranged in cavity formed in the insulating layer of the insulating substrate, with the top surface of the ceramic capacitor located in the generally same plane as the main surface of the insulating layer, and the external electrode of the ceramic capacitor is connected to the via-hole conductor located on the external electrode. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
