| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device without risk of having a ceramic thin plate deformed even if temperature is changed of the device having a structure retaining a ceramic thin plate with a metal thin plate. <P>SOLUTION: The device includes a ceramic thin plate 13 including a fired ceramic sheet, and a metal thin plate 12 having an outer shape larger than that of the ceramic thin plate 13. An outer peripheral portion of the ceramic thin plate 13 is joined to the metal thin plate 12. The metal thin plate 12 has through-holes 12c and a plurality of crease portions 12d, each having a ridge portion whose crest continuously extends from a joint portion between the ceramic thin plate and the metal thin plate toward an outer peripheral portion of the metal thin plate. Since thermal stress due to a difference in thermal expansion between the metal thin plate 12 and the ceramic thin plate 13 can be relaxed through expansion of the crease portions 12d, the ceramic thin plate 13 does not deform. <P>COPYRIGHT: (C)2008,JPO&INPIT |
